The Future of Micro-Contamination Control in Chemical Delivery Systems for Advanced Lithography, Wet Etch Clean Semiconductor Processes(PPT)

摘要

1. Beyond 14nm: New Challenges with Supply line contamination and Nano-defectivity 2. IDM Perspective of Problem Statement and End Goal 3. Examples of Wafer Contamination Sources and Importance 4. Addressing the Gaps: 4.1 Crittcality of Metrology Requirement: Defect Identification/Characterization 4.2 Supply Chain Responsibility & Quality Control 5. Need for Industry Collaboration: 5.1 Joint Responsibility 5.2 Expectation from POR Suppliers 6. End remarks