The relentless consumer demand for microelectronics products which are more compact and energy efficient, and which deliver greater functionality, translates into a need for more complex circuitry with smaller feature sizes. To fabricate such devices, manufacturers must explore new innovative packaging technologies. While mechanical cutting and drilling is well established for a variety of device packaging steps, the intrinsic limitations of this technology in terms of feature size and increased cost as features shrink are forcing manufacturers to transition some production steps to laser-based processes. Laser-based processes are extremely well suited for applications with feature sizes in the 10s of micron range as this is commensurate with the focused spot size of most visible and near infrared wavelength laser beams. Laser-based processes also fare well when only small volumes of material are removed. In both cases the natural progression of the packaging industry is shifting toward these attributes. Despite these advantages mechanical cutting and drilling continues to dominate. Laser based production equipment can have significantly higher initial purchase cost. Recent advances in laser power, reliability and cost per photon have shifted the cost equation. A more thorough understand of the cost of ownership allows a more holistic comparison. In addition to matching the feature sizes of today's packaging challenges, laser-based processes also allow to drive down production costs. Throughput can be significantly higher compared to mechanical tools. For example, scanners allow laser beams to jump from one part of the work piece to another in much less than 1 millisecond. Laser pulses are being used to remove just a very thin layer of material, thereby enabling very high control and precision. Composite materials are being drilled and cut with just one tool even as compositions change. Lack of physical contact means tool wear is eliminated. This in turn can lead to lower maintenance down time and less time spent on tool calibration. Laser-based processes also significantly reduce the cost of consumables (as for example, mechanical drill bits or end mills). The above factors combine to allow laser-based machines to deliver a lower operating cost although their initial investment cost might in some cases be higher.
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