Embedded Chip Technology: Technologies, Applications and Future Developments

摘要

Technology approaches for the embedding of active and passive components into build up layers of printed circuit boards have been explored during the last ten years. The adaptation of such technologies for industrial fabrication has attracted increasingly interest by manufacturers and first commercial products have been released. Still these technologies are subject of further developments, which will be addressed in this presentation. The major areas of interest are: a) Modularization of systems into embedded subsystems and their interconnection b) Embedded power electronics, c) Embedding using advanced processes materials. The realization of embedded modules is quite a robust process for different technologies. The process flow and challenges of such technologies for miniaturized modules and power packages will be presented. By nature of the process extremely flat packages can be realized. The routing of electrical contacts from the embedded components to the top and bottom side of the package allows the fabrication of highly versatile package layouts. The flatness and freedom in design makes these packages ideal candidates for package on package stacking. An example will be discussed where a stacked module containing Si chips in different layers realized.