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X-band Core Chip SiGe design for Phased Array T/R Modules

机译:X波段芯芯片SiGe设计用于分阶段阵列T / R模块

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The structure of the Core Chip for Phased Array T R Modules is presented. Methods for the formation of a phase delay for X phase shifters are considered. An original differential design of SiGe core chip for X-band is presented. The schematic of 5 bits phase shifter and attenuator are designed. It consist of a series number LPF and HPF filters. Gain of phase shifter is 1.5 dB. Attenuator has the adjustment range from 0 to 24dB. Linear output power of the core chip is 5dBm. The total consumed current of the device is 158mA, at 5V power supply.
机译:呈现了用于相控阵T r模块的核心芯片的结构。考虑了形成X相移换档的相位延迟的方法。提出了一种用于X波段的SiGe芯芯片的原始差分设计。设计了5位移相器和衰减器的示意图。它包括一个系列号LPF和HPF过滤器。移相器的增益为1.5 dB。衰减器的调整范围为0到24dB。核心芯片的线性输出功率为5dBm。在5V电源下,设备的总消耗电流为158mA。

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