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Design of a full 1Mb STT-MRAM based on advanced FDSOI technology

机译:基于高级FDSOI技术的全1MB STT-MRAM设计

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In one hand, the shrinking of CMOS technology nodes is dramatically increasing the leakage current in integrated circuits. In the other hand, modern portable devices first concern is power-efficiency to insure a better autonomy. Thus, new device technologies and computing strategies are required in integrated systems to save power without limiting processing performances. The use of Non-Volatile Memories (NVM) seems to be a choice of a great interest in complex computing systems. But, their integration within heterogeneous technologies remains a real challenge. Among emerging NV memories, Spin Transfer Torque Magnetic Random Access Memories (STT-MRAM) is considered as one of the most attractive candidates to overcome shortcomings of conventional memories. In this paper, we describe the design of a fully embedded STT-MRAM. We developed and validated a complete MRAM platform to simulate and evaluate a 1Mb STT-MRAM based on 28nm FDSOI technology. Furthermore, we exploited body back biasing techniques offered by the FDSOI technology to achieve 60% of decrease in term of leakage power and give the possibility to increase performance up to 2x.
机译:一方面,CMOS技术节点的收缩显着增加了集成电路中的漏电流。另一方面,现代便携式设备首先关注的是功能效率,以确保更好的自主权。因此,集成系统中需要新的设备技术和计算策略,以节省电力而不限制处理性能。使用非易失性存储器(NVM)似乎是对复杂计算系统的巨大兴趣的选择。但是,他们在异构技术中的整合仍然是一个真正的挑战。在新出现的NV存储器中,旋转转移扭矩磁性随机接入存储器(STT-MRAM)被认为是最具吸引力的候选人之一,以克服传统存储器的缺点。在本文中,我们描述了完全嵌入的STT-MRAM的设计。我们开发并验证了一个完整的MRAM平台,以模拟和评估基于28nm FDSOI技术的1MB STT-MRAM。此外,我们利用了FDSOI技术提供的身体背部偏置技术,以实现泄漏功率期限的60%,并提高绩效高达2倍的可能性。

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