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Simulation and Hardware Implementation of Interleaved SEPIC Converter with Valley-Fill Circuit for HBLED System

机译:谷谷填充电路对晶体填充电路的仿真与硬件实现

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摘要

LED lamps are nowadays preferred for lighting compared to the fluorescent lamps due to its longer lifetime and low power consumption. But the design of driver circuits designed for high brightness (HB) LED demands high power factor, more reliability, high efficiency and precise control. Therefore, to achieve this, a single-stage power factor correction model (PFC) and valley-fill is proposed in this paper. Valley-fill incorporated in SEPIC reduces the strain on output diode and middle capacitor, thus achieving great power factor and competence. Further to moderate the ripple at input and output stages, an interleaving concept is applied to SEPIC with valley-fill circuit. The combination of interleaving and valley-fill circuit leads to reduced voltage ripple, improved power factor and efficiency. A simulation study of the proposed SEPIC converter is carried out by MATLAB/SIMULINK. The performance factors such as source power factor, supply THD, supply distortion factor, supply displacement factor, power loss, output voltage ripple and efficiency are computed, and the results are compared with the classical SEPIC converter without valley-fill circuit. A prototype of an interleaved SEPIC converter is assembled to confirm the simulation results.
机译:如今,LED灯现在优选用于照明,与荧光灯相比,由于其较长的寿命和低功耗。但为高亮度(HB)LED设计的驱动电路设计需要高功率因数,更可靠性,高效率和精确控制。因此,为了实现这一点,本文提出了一种单级功率因数校正模型(PFC)和谷填充。山谷填充在SEPIC中掺入,减少了输出二极管和中间电容上的应变,从而实现了大功率因数和能力。此外,为了在输入和输出阶段中间中断纹波,将交错概念应用于脉冲填充电路的SEPIC。交织和谷填充电路的组合导致降低电压纹波,提高功率因数和效率。所提出的SEPIC转换器的仿真研究由Matlab / Simulink进行。计算出源功率因数,电源THD,电源失真因子,供应位移因子,电源损耗,输出电压纹波和效率等性能因素,并将结果与​​无谷填充电路的经典腐皮转换器进行比较。组装交错SPIC转换器的原型以确认模拟结果。

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