SOLID-STATE FOAMING OF POLYLACTIC ACID-HEXAGONAL BORON NITRIDE COMPOSITES TO FABRICATE THERMALLY CONDUCTIVE FOAMS

摘要

Micro-and-nano-electronic devices are prompting for new demands in light-weight and flexible multifunctional materials, including those for thermal management applications. In this context, this study presents a new industrial viable processing strategy to develop and fabricate light-weight thermally conductive polymer composites, through physical foaming, with reduced filler loadings. While foams are known for their good thermal insulating properties, experimental results revealed that foaming-induced filler reorientation would help to partially compensate the negative impact made by the voids on the composite's effective thermal conductivity (keff). As a case example, thermally conductive PLA-hBN composite foams were fabricated by solid-state carbon dioxide foaming. With a filler loading of as little as 10 vol.%, the PLA-hBN composite foam's keff was about 3.5 times higher than that of neat PLA.