Characteristics of the molten area in micro-welding of monocrystalline silicon and glass are described. In this study, 4 types of laser beam, which are nanosecond pulsed laser and picosecond pulsed laser of 532 nm and 1064 nm in wavelength were used for joining monocrystalline silicon and glass. Influence of wavelength and pulse duration on micro-welding of monocrystalline silicon and glass was experimentally investigated under the same spot diameter, and the molten area of monocrystalline silicon and glass was characterized. A splash area of molten silicon with 532 nm wavelength was wider than that with 1064 nm in a nanosecond pulse laser. However, its splash area of molten silicon with 1064 nm changed drastically at certain pulse energy of 11 μJ in a nanosecond pulse laser. On the other hand, 12.5 ps pulsed laser still kept a stable molten area appearance even at pulse energy of 11 μJ. A splash area of molten silicon around the weld bead line was obvious in the nanosecond pulsed laser. On the other hand, there was no remarkable molten splash around the weld bead line in the picosecond pulsed laser. It is concluded that the combination of picosecond pulse duration and infrared wavelength leads to a stable molten area appearance of the weld bead.
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