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An ALD Etch-back Method to Fabricate High Aspect Ratio Nanopillar Arrays for Photonic Crystal Sensors

机译:用于制造光子晶体传感器的高纵横比纳米玻璃阵列的ALD蚀刻方法

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An IC-compatible technique for photonic crystal sensors is presented here to fabricate dense arrays of high aspect ratios nanopillars, which are made of extremely hard materials that are difficult to shape, such as TiO2. This technique, called Atomic layer deposition ARrays Defined by Etch-back technique (AARDE), can significantly reduce direct bombardment on the functional surfaces and allows the precise control of the size of the densely spaced high pillars. A case study of an array of 1 urn pitch and 1.7μm high TiO2 pillars is investigated. Starting from 145 nm radius Si rods, the pillars are coated with a 78 nm thick ALD TiO2 layer and subsequently uncapped by a short time plasma etching. The exposed Si cores are then removed and a second ALD deposition is used to refill the opened holes and extend the pillar radius to the desired value.
机译:这里介绍了用于光子晶体传感器的IC兼容技术,以制造致密的高纵横比纳米玻璃阵列,其由极其坚硬的材料制成,难以形状,例如TiO 2。这种技术称为由蚀刻技术(Aarde)定义的原子层沉积阵列,可以显着减少功能表面上的直接轰击,并允许精确控制密集间隔高柱的尺寸。研究了对1个URN间距和1.7μm高TiO2支柱阵列的案例研究。从145nm半径Si棒开始,柱涂有78nm厚的Ald TiO2层,随后通过短的时间等离子体蚀刻封闭。然后除去暴露的Si芯,并使用第二ALD沉积来重新填充打开的孔并将柱半径延伸到所需值。

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