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Eliminating the top causes of customer-attributable integrated circuit failures

机译:消除客户归属集成电路故障的顶部原因

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The failure rates of electronic systems can be minimized if Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and Contract Manufacturers (CMs) follow specific guidelines for eliminating the most common causes of customer-attributable integrated circuit (IC) failures. Most importantly, OEMs/ODMs/CMs should always buy ICs directly from Original Component Manufacturers (OCMs) or their Authorized Distributors to ensure that ICs are authentic and have full factory warranties. Appropriate electrical overstress/electrostatic discharge (EOS/ESD) protection techniques should be used at the board-level and/or system-level. For particularly high-reliability applications, IC operating voltages and currents should be maintained well below IC Absolute Maximum Ratings. Since the failure rate for many IC failure mechanisms increases exponentially with increasing temperature, electronic systems should be designed to provide adequate cooling. Finally, OCMs' instructions for proper storage, handling, and board mounting of ICs need to always be followed, with particular attention given to moisture-sensitive components.
机译:如果原始设备制造商(OEM),原始设计制造商(ODMS)和合同制造商(CMS),则可以最大限度地减少电子系统的故障率遵循特定指南,以消除客户归属集成电路(IC)故障的最常见原因。最重要的是,原始设备制造商/原始设计制造商/ CMS应该总是直接从原厂配件制造商(OCMS)或其授权分销商购买芯片,以确保IC是真实的,有充分的工厂保证。应在板级和/或系统级别使用适当的电灯过度/静电放电(EOS / ESD)保护技术。对于特别是高可靠性应用,IC工作电压和电流应远低于IC绝对最大额定值。由于许多IC故障机制的故障率随着温度越来越大而呈指数级,因此应设计电子系统以提供足够的冷却。最后,OCMS的正确存储,处理和板安装IC的说明需要始终遵循,特别是对湿度敏感组件的特别关注。

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