Study of Microstructure and Electrical Properties of Bulk YBCO Prepared by Melt Textured Growth Technique

摘要

Bulk YBCO components were prepared using Melt Texture Growth (MTG) technique. Components were fabricated using MTG by addition of Y_2BaCuO_5 (Y211) and Ag to YBCO, which leads to improved grain size without affecting superconducting properties. Green compacts prepared by cold isostatic pressing were pre-sintered at 930°C before subjecting melt texturing. Cooling rates lower than 1 °C.h~(-1) was used, in between (peritectic) temperature of about 995 and 1025°C, to obtain large grained components. Microstructure studies in details were carried out by Scanning Electron Microscope (SEM), Electron Probe Micro Analysis (EPMA), Orientation Imaging Microscope (OIM) and TEM correlated with electrical properties like Critical current density (J_c).