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Determination of Trap Depth in nc-CdSe:Cu Thin Films Using Thermally Stimulated Current Measurements

机译:NC-CDSE中陷阱深度的测定:使用热刺激电流测量的Cu薄膜

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Cooper doped nanocrystalline CdSe (nc-CdSe:Cu) thin films are prepared by thermal vaccum evaporation technique using the inert gas condensation method taking Ar as inert gas. TSC measurements are performed at three different heating rates 0.05 K/s, 0.066 K/s and 0.083 K/s for CdSe:Cu thin films. The noticeable shift in TSC peak towards higher temperatures is observed at higher heating rates. We have calculated trap depth using single trap analysis which is found to be approximately 0.5 eV.
机译:Cooper掺杂纳米晶CDSE(NC-CDSE:Cu)薄膜通过热真空蒸发技术使用惰性气体冷凝方法作为惰性气体制备。 TSC测量以三种不同的加热速率进行0.05 k / s,0.066 k / s和0.083k / s,用于Cdse:Cu薄膜。在更高的加热速率下观察到TSC峰值达到较高温度的显着变化。我们使用单一陷阱分析计算了陷阱深度,该分析被发现约为0.5eV。

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