Using a Compact Process Monitor (CPM) Residual Gas Analyzer to Optimize Tool Throughput at Rapid Thermal Anneal - (PPT)

摘要

As device dimensions and tolerances continually shrink in response to performance and manufacturing cost requirements, throughput improvements become critical. Improved tool throughput can be considered either a function of increased number of wafers per hour or increased yield from the process. These two approaches demand a focus on both the physical operation of the equipment and the processes within the chamber. For metal processes in particular, Rapid Thermal Anneal (RTA) is sensitive to species contamination. Contamination can be due to chamber or load lock leaks, photoresist contamination or wafer out gassing. Additionally, throughput and cycle time issues are also major concerns since capital outlay for new tools and factory floor space is restrictive when increased capacity is required.