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Fin Pitch Impact on Biaxial/Uniaxial Strain Engineering of Triple-Gate Devices

机译:三栅装置双轴/单轴应变工程的翅片间距影响

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This work characterizes the analog performance of SOI n-MuGFETs with uniaxial and biaxial strain configuration with respect to the influence of the fin pitch distance. Improved intrinsic gain can be achieved on strained devices independent of the pitch, mainly due to the increased transconductance. Larger fin pitch in the uniaxial strain case showed a higher gain. However, for the biaxial devices the smaller pitch resulted in a larger gain thanks to the increased Early voltage.
机译:这项工作表征了具有单轴和双轴应变配置的SOI n-Mugfet的模拟性能,相对于翅片间距距离的影响。可以在独立于间距的应变器件上实现改进的内在增益,主要是由于跨导增加。单轴应变情况下的较大的翅片间距显示出更高的增益。然而,对于双轴设备,由于提高的早期电压,较小的间距导致更大的增益。

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