Silicon-on-Insulator technology, with unique properties such as harsh environment resistance and lower power consumption (1), is presented here as a platform for CMOS and MEMS co-integration. An original CMOS-compatible process has been developed for the design and the co-fabrication of out-of-plane movable cantilevers and ring oscillators circuits on the same chip. The measured transducer, by deflection of the out-of-plane MEMS component, shows until 10% variation of the frequency under different flow rates.
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