A Novel Low Cost Technique to Perform Concurrent Topside and Backside Analysis of a Bare Die

摘要

A novel low cost technique to facilitate concurrent topside and backside imaging of a bare die for optical fault localization purposes is presented. The technique overcomes the restrictions posed by unavailability of a suitable package or limited choices that may be present at a small scale packaging lab. The difficulties imposed on backside preparation of commonly used ceramic packages are overcome by providing an alternative that is relatively less expensive and easier to implement. This is accomplished by mounting the bare die on a glass cover slip using a suitable adhesive and wire bonding the bond pads to a specially designed printed circuit board. This method is being successfully utilized on multiple failure analysis requests received in our lab.