首页> 外文会议>IEEE/CPMT International Electronic Manufacturing Technology Conference >Apply to the package substrate of low low-CTE polyimide laminate sheet

【24h】

Apply to the package substrate of low low-CTE polyimide laminate sheet

机译：适用于低低压聚酰亚胺层压板的封装基板

获取原文

页面导航

著录项
相似文献
相关主题

著录项

来源
《IEEE/CPMT International Electronic Manufacturing Technology Conference》|2010年||共27页
会议地点
作者
Tsuchiya Toshiyuki; Yoshida Takefumi; Tsutsumi Masayuki; Maeda Satoshi; Tsukada Yutaka;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类 TN105-53;
关键词

相似文献

外文文献
中文文献
专利

1. In-plane Orientation in Colorless Polyimides as Induced by Solution Casting from Polyimide Varnishes (6). Applications to Low-CTE and Transparent Plastic Substrates [J] . Tomohiro ISHIGAMI, Junichi ISHH, Masatoshi HASEGAWA 高分子 . 2012,第3期

机译：由聚酰亚胺清漆的溶液浇铸引起的无色聚酰亚胺的面内取向（6）。低热膨胀系数和透明塑料基材的应用
2. Opto-Electronic Chip-on-Film Packaging Technology Using Low-CTE Fluorinated Polyimide Optical Waveguide Films [J] . Usui M., Ishibashi S., Hirata H., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2014,第10期

机译：使用低CTE氟化聚酰亚胺光波导薄膜的光电薄膜封装技术
3. Packaging Substrate Applications of Ultra Low CTE Polyimide [J] . Toshiyuki Tsuchiya, Satoshi Maeda, Yutaka Tsukada Journal of Photopolymer Science and Technology . 2012,第3期

机译：超低CTE聚酰亚胺的包装基板应用
4. Apply to the package substrate of low low-CTE polyimide laminate sheet [C] . Tsuchiya Toshiyuki, Yoshida Takefumi, Tsutsumi Masayuki, Proceedings of the 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium . 2010

机译：适用于低CTE低聚酰亚胺层压板的包装基板
5. System-on-package integration for millimeter-wave circuits using low-cost laminates [D] . Aroor, Supreetha Rao. 2013

机译：使用低成本层压板的毫米波电路的系统级封装集成
6. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates [O] . Yao-yao Tan, Yan Zhang, Gang-lan Jiang, 2020

机译：热膨胀系数极低的固有黑色聚酰亚胺薄膜的制备和性能及其在黑色柔性覆铜箔层压板中的潜在应用
7. Packaging Substrate Applications of Ultra Low CTE Polyimide [O] . Toshiyuki Tsuchiya, Satoshi Maeda, Yutaka Tsukada 2012

机译：超低CTE聚酰亚胺的包装基材应用
8. Deposition of Aluminum--Copper Alloy on Laminated Polyimide Substrates from a RF Induction Source [R] . Hale, G. J. 1979

机译：从射频感应源在层压聚酰亚胺基板上沉积铝 - 铜合金

获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

客服微信
服务号