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Programmable picosecond pulse packets for micromachining withmultiwatt UV fiber lasers

机译:用于MICLIIWATT UV光纤激光器的可编程PICOSECOND脉冲包

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Nanosecond class lasers have been the mainstay of optical machining for decades, delivering pulses with high fluences (>1 J/cm~2) that cause many material sets to undergo thermally-induced phase changes to cause removal of matter. While in many cases their delivery of sheer laser power has proved useful, nanosecond lasers have fallen short of addressing current micromachining requirements with respect to decreased feature sizes and more complex substrates. One main issue is the laser pulse width endures throughout the ablation process, depositing energy is deposited into plasma formation and local material heating. Plasma shielding takes place when the laser pulse energy contributes to plasma formation to a greater extent than direct material ablation processes. The result is a crude "plasma cutter" of the substrate, leaving a telltale trail of localized dross and droplet deposition. Nanosecond lasers of sufficient process speeds are typically Q-switched with repetition rates less than 200 kHz. As a result, the scribed lines are made of a sequence of "blast events" that result in a variety of undesired consequences and a limited process speed.
机译:纳秒级激光器一直是光学加工的主干,几十年来,提供​​高分流量(> 1J / cm〜2)的脉冲,导致许多材料套件进行热诱导的相变,以导致物质的去除。虽然在许多情况下,它们的纯粹激光功率的传递已经证明有用,但纳秒激光器已经缺乏寻址关于特征尺寸和更复杂的基板的电流微加工要求。一个主要问题是激光脉冲宽度在整个消融过程中,沉积能量沉积成等离子体形成和局部材料加热。当激光脉冲能量在比直接材料烧蚀过程中达到更​​大程度的程度时,发生等离子体屏蔽。结果是基板的粗制性“等离子体切割器”,留下局部渣滓和液滴沉积的Telltale Trail。足够的过程速度的纳秒激光通常是Q-切换的重复率小于200 kHz。结果,划线线由一系列的“爆炸事件”组成,其导致各种不希望的后果和有限的过程速度。

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