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Capacitive and Resistive RF-MEMS switches 2.5D #x00026; 3D Electromagnetic and Circuit Modelling

机译:电容和电阻RF-MEMS开关2.5D和3D电磁和电路建模

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In this paper proposes different strategies for the electrical modelling of capacitive and resistive RF-MEMS switches which take into account the dependence of the electrical performance on the mechanical properties and technological processes. The EM modelling of MEMS switches is addressed with 2.5D and 3D full wave EM softwares. More specifically, ADS-MomentumTM (2.5D) and EMDSTM (3D) from Agilent Technologies are used. Capacitive RF-MEMS switches were fabricated with the LAAS-CNRS 6-mask RF-MEMS process in Toulouse, France, and resistive RF-MEMS switches were fabricated with the FBK-irst 8-mask RF-MEMS process in Trento, Italy. It is shown that, by applying the proposed strategies, 2.5D and 3D simulations are in good agreement with characterization results.
机译:本文提出了电容性和电阻RF-MEMS开关的电气建模的不同策略,其考虑了电气性能对机械性能和技术过程的依赖性。 MEMS交换机的EM建模是用2.5D和3D全波EM软件寻址。更具体地,使用来自安捷伦技术的ADS-MIMILUM TM (2.5d)和EMDS TM (3D)。电容式RF-MEMS开关用Toulouse,法国的LaAS-CNR 6掩模RF-MEMS工艺制造,并且通过FBK-IRST 8掩模RF-MEMS工艺在意大利的FBK-IRST 8掩模RF-MEMS工艺制造。结果表明,通过应用拟议的策略,2.5D和3D模拟与表征结果吻合良好。

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