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Influence of Si surface on damage generation and recombination

机译:Si表面对损伤生成和重组的影响

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We have studied the influence of Si surface on damage generation and recombination using classical Molecular Dynamics simulations. We have found that, when approaching to the surface, damage generation is enhanced due to weaker atomic bonding. Furthermore, generated damage is more stable as it reveals the mean lifetime of defects and the activation energy for recombination. Therefore near the surface damage is generated easily and it is more stable than in the bulk. These findings explain the experimental observations of a reduced amorphization threshold for the formation of ultra-shallow junctions and the difficulty to regrowth ultra thin body Si devices.
机译:我们研究了Si表面对使用经典分子动力学模拟的损伤生成和重组的影响。我们发现,当接近表面时,由于原子粘合较弱,损伤产生增强。此外,产生的损坏更稳定,因为它揭示了缺陷的平均寿命和用于重组的活化能量。因此,在表面损伤附近易于产生表面损坏,并且比散装更稳定。这些发现解释了对形成超浅结的形成和难以再生超薄体Si器件的实验观察。

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