(AerospaceBook)DIFFUSION BONDING OF Al7075 TO Ti-6Al-4V USING EUTECTIC FORMING INTERLAYERS

摘要

Two dissimilar aerospace alloys Ti-6Al-4V and Al7075 were diffusion bonded using a zinccoatings and copper interlayers. The eutectic reactions of Al-Zn and Al-Cu were used to produce bondsbetween the titanium and aluminum alloys. The scanning electron microscopy (SEM) and EnergyDispersive X-ray (EDX) analysis showed that at longer bonding times, the formations of brittlemicrostructures such as zinc oxide and aluminum oxide dominate the joint region when bonding with zinccoatings. The diffusion bonds formed using copper interlayers have showed better results within a moreuniform hardness profile across the bonded interface.