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Diffusion bonding of Al7075 alloy to titanium aluminum vanadate alloy.

机译:Al7075合金与钛酸钒铝合金的扩散结合。

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摘要

The aluminum alloy (Al7075) and titanium alloy (Ti-6Al-4V) are used in a variety of applications in the aerospace industry. However, the high cost of Ti-6Al-4V alloy has been a major factor which has limited its use and therefore, the ability to join Al7075 alloy to Ti-6Al-4V alloy can provide a product that is less costly, but retains the high strength and light weight properties necessary for the transport industry. However, the large difference in the physical properties between these two alloys prevents the use of conventional joining techniques such as fusion welding to join these dissimilar alloys. Therefore, the diffusion bonding technique was used to join Al7075 alloy to Ti-6Al-4V alloy with the objective of minimizing microstructural changes of the two alloys during the bonding process. In this thesis, solid state and liquid phase bonding processes were undertaken. Solid state bonding was employed without interlayers and was successful at 510°C and 7 MPa. The bond interface showed an absence of the oxides due to the dissolution of oxygen into the titanium solution. Bonds made using copper interlayers at a temperature sufficient enough to form eutectic liquid formation between copper and aluminum were produced. The intermetallics theta(Al2Cu), S(Al2CuMg) and T(Al2Mg3Zn3) were identified at the aluminum interface while Cu3Ti2 intermetallic was identified at the titanium interface. Bonds made using tin based alloys interlayers and copper coatings were successful and gave the highest shear strength. The eutectic formation on the Al7075 alloy was responsible for joint formation at the aluminum interface while the formation of Sn3Ti5 intermetallic was responsible for the joint formation at titanium interface. The corrosion rate of the bonds decreased with increasing bonding time for joints made using the tin based interlayer in 3% NaCl solution. However, the presence of copper within the joint increased the corrosion rate of the bonds and this was attributed to the corrosive effect of copper in the Al7075 alloy.
机译:铝合金(Al7075)和钛合金(Ti-6Al-4V)在航空航天工业中有多种应用。但是,Ti-6Al-4V合金的高成本一直是限制其使用的主要因素,因此,将Al70​​75合金与Ti-6Al-4V合金连接的能力可以提供成本较低的产品,但仍保留了运输行业所需的高强度和轻质性能。但是,这两种合金之间的物理性能差异很大,因此无法使用常规的连接技术(例如熔焊)来连接这些异种合金。因此,扩散扩散技术用于将Al70​​75合金连接到Ti-6Al-4V合金,目的是使两种合金在粘结过程中的微观结构变化最小。本文研究了固相和液相键合工艺。使用没有中间层的固态键合,并在510°C和7 MPa下成功。由于氧气溶解在钛溶液中,键合界面显示不存在氧化物。产生使用铜中间层在足以在铜和铝之间形成共晶液体形成的温度下形成的结合。在铝界面处鉴定出金属间化合物theta(Al2Cu),S(Al2CuMg)和T(Al2Mg3Zn3),而在钛界面处鉴定出Cu3Ti2金属间化合物。使用锡基合金中间层和铜涂层制成的粘结是成功的,并具有最高的剪切强度。 Al7075合金上的共晶形成是在铝界面上形成接头的原因,而金属间Sn3Ti5的形成是在钛界面上形成接头的原因。对于使用锡基中间层在3%NaCl溶液中制成的接头,随着时间的延长,键的腐蚀速率降低。然而,接头内铜的存在增加了键的腐蚀速率,这归因于Al7075合金中铜的腐蚀作用。

著录项

  • 作者

    Alhazaa, Abdulaziz Nasser.;

  • 作者单位

    University of Calgary (Canada).;

  • 授予单位 University of Calgary (Canada).;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 252 p.
  • 总页数 252
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:37:12

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