Testing and Specifying Thermal Performance of DC-DC Power Modules used in Sealed Box Applications

摘要

Output power derating vs. ambient temperature and airflow is a widely used method for defining the thermal limitations of dc-dc power modules. However, this method is not suitable for sealed box applications where the modules are mainly conduction cooled by means of an external heatsink often referred to as a "cold wall" or "cold plate". In this paper a new method for testing and presentation of results for dc-dc modules in such applications is proposed.