首页> 外文会议>International Symposium on Power Semiconductor Devices ICS >A High Current 3300V Module Employing Reverse Conducting IGBTs Setting a New Benchmark in Output Power Capability
【24h】

A High Current 3300V Module Employing Reverse Conducting IGBTs Setting a New Benchmark in Output Power Capability

机译:高电流3300V模块,采用反向导电IGBT设置输出功率能力的新基准

获取原文

摘要

In this paper we demonstrate a fully functional high voltage and high current IGBT module rated at 3300V consisting solely of Reverse Conducting (RC) IGBT chips. The RC-IGBTs were designed in accordance with the latest Enhanced Planar and Soft Punch Through technology while incorporating an integrated freewheeling diode in the same silicon volume. Future high power IGBT modules with RC-IGBT technology will be capable of providing exceptional electrical performance for the given voltage class in terms of the maximum allowable output current capability.
机译:在本文中,我们展示了在3300V的完全功能的高压和高电流IGBT模块,该模块仅由反向导电(RC)IGBT芯片组成。 RC-IGBT根据最新增强的平面和软冲压技术设计,同时在相同的硅容积中结合了集成的续流二极管。具有RC-IGBT技术的未来高功率IGBT模块将在最大允许输出电流能力方面提供给定电压等级的特殊电气性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号