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Study of Gettering Mechanisms in Silicon: Competitive Gettering Between Phosphorus Diffusion Gettering and Other Gettering Sites

机译:硅中吸收机制的研究:磷扩散吸血管与其他吸收网站的竞争气体

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The effectiveness of phosphorus diffusion gettering (PDG) and related segregation coefficients for different metal impurities were measured applying thermal treatments in the temperature range 800-950 °C for different times. We used multi-crystalline and mono-crystalline CZ p-type wafers with different boron concentrations and different levels of dislocations and bulk micro-defects (BMD). In all sample types, for Cu and Ni we found complete gettering in the temperature range investigated. In the case of Fe, the segregation coefficient increases with both increase in temperature and extension of time. The increase is qualitatively changing when going above 900 °C. At 950 °C the segregation coefficient increases faster at shorter diffusion time but at extended diffusion time it increases slower as compared to diffusion at 900 °C. At the same temperature and time of phosphorus diffusion the segregation coefficient is found to be independent of the metal impurity concentration in the range of 10~(12)-10~(12) cm~(-3) investigated. We have shown that the presence of BMD and dislocations in bulk silicon does not impede the ability of PDG to completely remove Fe, Ni and Cu metal impurities from the bulk. Further analysis suggests that the PDG has the same gettering efficiency for mono-crystalline silicon and multi-crystalline silicon. We conclude that if any bulk precipitation of Fe, Ni and Cu impurities is present in multi-crystalline silicon it cannot seriously compete with PDG However we found that increasing the boron concentration in the samples reduces the segregation coefficient of Fe, and this reduction is more severe at lower temperatures. Finally, by applying a post anneal ramp down from 900 °C to 700 °C after phosphorus diffusion, we found that the Fe segregation coefficient increases by a factor of 36 for lightly B doped samples, from 53 to 1919, leading to a significant reduction of Fe in the bulk after 2 hours ramp down anneal.
机译:测定磷扩散吸杂(PDG)以及相关的偏析系数的不同金属杂质的效果的温度范围800-950℃下进行不同的时间施加热处理。我们用多晶和单晶CZ p型晶片具有不同硼浓度和不同水平的位错和本体微缺陷(BMD)。在所有样本类型,铜,镍,我们发现完全吸除的温度范围内调查。在Fe的情况下,所述偏析系数与两个温度增加和时间的延长而增加。 900℃以上时会增加定性改变。在950℃下在更短的扩散时间更快偏析系数增加,但在延长的扩散时间它增加较慢相比,在900℃下扩散。在磷扩散的相同的温度和时间的偏析系数被认为是独立在10〜(12)-10〜(12)的范围内的金属杂质浓度厘米〜的(-3)的影响。我们已经表明,BMD的存在和位错在体硅不妨碍PDG的从散装完全除去的Fe,Ni和Cu的金属杂质的能力。进一步的分析表明,PDG具有单晶硅,多晶硅相同的吸气效率。我们得出结论,如果铁,Ni和Cu杂质任何本体沉淀存在于多晶硅它不能严重地PDG竞争然而,我们发现,在样品中增加硼的浓度降低Fe的偏析系数,并且这种降低是更严重在较低的温度。最后,通过施加退火后从900℃斜线下降到磷扩散之后700℃下,我们发现,通过36轻轻B中的因子中的Fe偏析系数增加掺杂的样品,从53到1919,导致显著减少Fe的散装在2小时后斜降退火。

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