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Selective Hardening of NanoPLA Circuits

机译:纳米电路的选择性硬化

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摘要

Nanoelectronic components are expected to suffer from very high error rates, implying the need for hardening techniques. We propose a fine-grained approach to harden a promising class of nanoelectronic circuits, called NanoPLAs, against errors. An analytical procedure and simulations are both incorporated into the algorithm to identify the most critical error locations. By targeting errors with the largest impact for a given circuit, the method can provide significant reliability boost at low cost. Furthermore, the method yields a plethora of alternative designs, trading off hardening costs against circuit robustness. In many cases, solutions found achieve both lower cost and higher robustness compared with the duplication-based hardening strategy introduced before.
机译:预期纳米电子元件遭受非常高的误差率,这意味着需要硬化技术。我们提出了一种精细粒度的方法来硬化一个被称为纳米片的纳米电子电路的有前途的纳米电路,抵抗误差。分析过程和模拟都被融入算法中以识别最关键的错误位置。通过针对给定电路的最大冲击的误差,该方法可以以低成本提供显着的可靠性升压。此外,该方法产生过多的替代设计,抵消电路鲁棒性的硬化成本。在许多情况下,与之前引入的复制的硬化策略相比,解决方案发现均可实现较低的成本和更高的鲁棒性。

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