The processing–structure–property relationship is investigated for electrodeposited foils of the gold–copper alloy system. A model is presented that relates the deposition process parameters to the nanocrystalline grain size. An activation energy of 1.52 eV atom1 for growth is determined for a long-pulse (>10 msec) mode, and is 0.16 eV atom1 for short pulses (<5 msec). The effect of nanocrystalline grain size on the mechanical properties is assessed using indentation measurements. A Hall–Petch type variation of the Vickers microhardness with nanocrystalline grain size (>6 nm) is observed for Au–Cu samples with 1–12 wt.% Cu as tested in cross-section. The hardness increases three-fold from a rule-of-mixtures value <1 GPa to a maximum of 2.9 GPa.
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