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Mold Die Design to Improve Flash Remains for Micro Miniature Package

机译:模具模具设计改进闪光仍为微型微型包装

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This paper describes a new mold design which establish a predetermined break point to enhance elimination of excess lead Mold Flash (MF) on miniature small outline surface mount (SOSM) packages, such as SOD523. Typical lead MF in SOSM packages is commonly found despite many processes to eliminate them for customer satisfaction. SOD523 has been one of the many packages with excess lead MF due to process capability, which at times can lead to customer incidents. This new lead slot design is a combination of triangular and wing type concepts that will eliminate lead MF defects.
机译:本文介绍了一种新的模具设计,该模具设计建立了预定断裂点,以增强超铅模具闪光(MF)在微型小型表面支架(SOSM)包装上的消除,例如SOD523。尽管许多过程消除了客户满意度,但仍然发现了SOSM封装中的典型引线MF。 SOD523是由于工艺能力引起的众多封装之一,其有时会导致客户事件。这种新的铅槽设计是三角形和翼型概念的组合,可以消除引线MF缺陷。

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