KOH/SURFACTANT AS AN ALTERNATIVE TO KOH/IPA FOR TEXTURISATION OF MONOCRYSTALLINE SILICON

摘要

This work reports on the development of KOH/surfactant as an alternative to the conventional KOH/IPA solution for surface texture of monocrystalline silicon wafers. Replacement of IPA by surfactants of very low concentration below 0.01% allows much higher process temperatures close to the boiling point (～98°C) of the bath. Mean reflexions of less than 12% in the wavelength range of 400 to 1100 nm are achieved. High etch-rates reduce the process time to 10 minutes, allowing the texturing process economically attractive.