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High Voltage CMOS Line-up for Display Driver Applications based on 0.13μm CMOS with Aluminum metallization Scheme

机译:基于0.13μm的CMO与铝金属化方案,高压CMOS阵列显示驱动器应用

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The present paper describes the development of high voltage CMOS process line-up (5/11/20/30V) for display driver applications, based on 0.13μm CMOS process with aluminum metallization. The advantages are smaller size of SRAM bit cell and lower process cost. High voltage CMOS devices, 1.5V(LV) logic CMOS, 5.5V(MV)CMOS, poly-Si resistor (HR/MR), MOS-capacitor, SRAM and OTP are available. 10.8μm device pitch of 30V CMOS and good electric characteristics were successfully achieved. Thanks to the low cost and wide voltage options, various kind of display driver lCs can now be realized in smaller die size and lower cost.
机译:本文介绍了基于0.13μm的CMOS方法,铝金属化的高电压CMOS工艺阵线(5 / 11/20 / 30V)的开发。优点是SRAM位细胞尺寸较小,并降低工艺成本。提供高压CMOS器件,1.5V(LV)逻辑CMOS,5.5V(MV)CMOS,Poly-Si电阻(HR / MR),MOS电容,SRAM和OTP。成功实现了10.8μm的装置间距30V CMOS和良好的电气特性。由于低成本和宽的电压选项,现在可以以较小的模具尺寸和更低的成本实现各种显示驱动器LCS。

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