Advanced Technology Facilities – Semiconductor Fabrication Facilities

摘要

Fabrication facilities serving integrated circuit (IC) and FPD (flat panel display) manufacturing have evolved through the years. These “fab” facilities are unique in many aspects. One of their unique features is the fact that they are cleanroom environments designed to control particle, temperature, humidity, vibration, and noise contaminants. The current-generation high-end IC manufacturing is dedicated to handling 300mm silicon wafers using 0.090 micron (90 nanometers) feature size. This paper discusses the structural concepts of these fabs. The fab structure is controlled by micro-vibration performance. The paper blends discussion on the unique structural features of the state-of-the-art fabs with their vibration design fundamentals. Construction techniques and materials are also covered. On one hand, member sizing of fab floors, columns, foundations, lateral systems are dictated by the vibration design. On the other hand, other facility needs such as fire code issues, space utilization, functionality and production tool layout impose other constraints on the fab structures.