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Consolidation of Free-Cutting Lead-Free Brass by Hot Extrusion and its Properties

机译:通过热挤出和其性能整合自由切削无铅黄铜

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In this study, attempts were made to develop a method for consolidating of 6-4 brass chips and producing a free-cutting, lead-free brass alloy. Because chips of a lead-free brass alloy are not available commercially, a 6-4 brass alloy was cast. Next, chips in shapes similar to those produced as scrap were prepared by machining a Cu-Zn ingot. Cu2S powder was added to the brass chips as an alternative to lead, and they were mixed. The mixture was compressed in a mold and directly consolidated as an extruded rod by hot extrusion at 773 K. After extrusion, results of tensile tests conducted to examine the mechanical properties of the extruded rods showed that the tensile strength and elongation decreased with the addition of Cu2S. Cross-sectional microstructure observation showed that the microstructure became dense with an increase in the extrusion ratio. Energy dispersive X-ray (EDX) analysis showed a sulfur-rich area in the rods with a low extrusion ratio. In contrast, sulfur dispersed homogeneously in rods at a high extrusion ratio. The density increased by increasing the extrusion ratio and decreased by the addition of Cu2S. The hardness of the specimens containing Cu2S increased with an increase in the extrusion ratio, while the hardness of the Cu2S-free rod was very low. A cutting resistance test and chip observation indicated that an increase in the amount of Cu2S additive improved the machinability. After extrusion, almost satisfactory extruded rods were obtained, while a non-bonded region was observed around the top of each extruded rod.
机译:在这项研究中,尝试开发一种用于固结6-4个黄铜芯片并产生自由切割的无铅黄铜合金的方法。因为无铅黄铜合金的芯片不可用,所以铸造了6-4个黄铜合金。接下来,通过加工Cu-Zn锭制备与作为废料产生的形状类似的形状的芯片。将Cu 2 S粉末作为替代物加入黄铜芯片中,并混合它们。将混合物在模具中被压制并通过热挤出在773k中直接固结。挤出后,进行的拉伸试验结果检查挤出棒的机械性能,表明拉伸强度和伸长率随着添加而降低CU2S。横截面微结构观察表明,微观结构变得致密,挤出比率增加。能量分散X射线(EDX)分析显示挤出比具有低钢筋的富含硫的区域。相反,硫以高挤出比在杆中均匀分散。通过增加挤出比率并通过加入Cu 2来增加密度增加。含有Cu2s的试样的硬度随挤出比的增加而增加,而无需棒的硬度非常低。切削抗性试验和芯片观察表明Cu2S添加剂量的增加改善了可加工性。挤出后,获得几乎令人满意的挤出棒,而在每个挤出棒的顶部围绕每个挤出棒的顶部观察非粘结区域。

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