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Determination of Effective Diffusion Coefficient of Copper in Silicon by Diffusion from Bulk into the Polysilicon Backside

机译:通过扩散到多晶硅背面的硅中硅中铜有效扩散系数的测定

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ifferent temperatures has been measured. The quantitative diffusion and gettering of Copper from the bulk into the polysilicon backside have been measured at different temperatures 200 °C, 250 °C, 300 °C and 350 °C, in silicon doped with 1.14x10~(18) (0.04 Ωcm), 3.24x10~(18) (0.02 Ωcm) and 8.49x10~(18) (0.01 Ωcm) boron atoms/cm3. This result has been compared with modeling values calculated by the equation for effective diffusion coefficient reported by A. Istratov et al. We have proposed a simple numerical equation for the calculation of the effective Cu diffusion coefficient for a wide range of boron concentration N_a<10~(19) atoms/cm3 in silicon. From the results of this study it has been suggested that in the presence of high boron concentrations the gettering mechanism in backside polysilicon is governed by segregation type gettering.
机译:已经测量了iFferent温度。在不同温度200℃,250℃,300℃和350℃下测量从体积到多晶硅背面的定量扩散和吸收器,在掺杂1.14x10〜(18)(0.04Ωcm) ,3.24x10〜(18)(0.02Ωcm)和8.49x10〜(18)(0.01Ωcm)硼原子/ cm3。将该结果与由A.Stratov等人报告的有效扩散系数的方程计算的建模值进行了比较。我们提出了一种简单的数值方程,用于计算硅中宽范围的硼浓度N_A <10〜(19)原子/ cm3的有效Cu扩散系数。从本研究的结果,已经提出,在高硼浓度存在下,背面多晶硅的吸气机制由分离型气体控制。

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