首页> 外文会议>International Symposium on High Dielectric Constant Gate Stacks >THE INFLUENCE OF NH_3 ANNEAL ON THE CRYSTALLIZATION KINETICS OF HfO_2 GATE DIELECTRIC FILMS
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THE INFLUENCE OF NH_3 ANNEAL ON THE CRYSTALLIZATION KINETICS OF HfO_2 GATE DIELECTRIC FILMS

机译:NH_3退火对HFO_2栅电介质膜结晶动力学的影响

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HfO_2 gate dielectric thin films have been exposed to anneal processing in NH_3 and N_2 ambient in order to decouple the influence of N incorporation from that of the thermal cycle alone. We report on the effectiveness of NH_3 processing to introduce N into the dielectric film system and characterize the local coordination and crystallization kinetics that give rise to the resultant high-k film microstructure as determined from a variety of high resolution spectroscopic and imaging analysis techniques.
机译:HFO_2栅极介电薄膜已经暴露于NH_3和N_2环境中的退火处理,以便将N单独的热循环的掺入的影响分离。我们报告了NH_3处理的有效性,将n引入介电薄膜系统,并表征局部配位和结晶动力学,从而产生由各种高分辨率光谱和成像分析技术确定的高k薄膜微观结构。

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