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Effect of Surface Nitridation on the Ge/HfO_2 Interface

机译:表面氮化对GE / HFO_2接口的影响

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Effect of Ge surface nitridation, prior to HfO_2 deposition, on Ge/HfO_2 interface has been studied using low temperature measurements. C-V characteristics at room temperature show significant dispersion in nitrided devices compared to non-nitrided devices as a function of frequency. Electron trapping is found to be dominant as temperature was reduced to 140K. Estimated activation energies in nitrided and nonnitrided devices indicate that surface nitridation is introducing new trap levels in bulk oxide. Constant voltage stress shows hole trapping being dominant in non-nitrided devices. In nitrided devices, effect of both hole and electron trapping is observed at higher stress level and higher charge injection.
机译:在HFO_2沉积之前Ge表面氮化的影响已经使用低温测量研究了GE / HFO_2界面。室温下的C-V特性显示出与非氮化器件相比的氮化器件中的显着色散,作为频率的函数。由于温度降至140K,发现电子捕获是占优势。氮化和非氮化器件中的估计激活能量表明表面氮化是在氧化物中引入新的陷阱水平。恒压应力显示孔俘获在非氮化器件中优势。在氮化装置中,在更高的应力水平和更高的电荷注入时观察到孔和电子捕集的效果。

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