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Micro Fluidic Mass Flow Sensor Concept for Functional Ceramic Circuits

机译:功能陶瓷电路的微流体质量流量传感器概念

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摘要

Low temperature co-fired ceramics (LTCC) is established as a widespread platform for advanced functional ceramic circuits in many different applications, such as space, aviation, medical and sensor technology. MLC (Multi Layer Ceramics) based systems allows integrating passive components which leads to a high integration level. For micro fluidic devices the integration of 3D structures like channels and chambers are necessary. Using LTCC is predestined to integrate sensor elements due to the high reliability qualities, the good characteristics of the ceramic as well as the excellent physical properties. To realize 3D micro channels not only in lab status adequate manufacturing processes are mandatory. This study proposes the realization of micro fluidic channels and show in which ways these can be realized by a range of new developed manufacturing methods during the LTCC process. A benchmark of 3D laser structuring and two cold embossing technologies were investigated to show the benefits and also the limits of each technology. The sensor elements, which were directly integrated into the LTCC body, are based on PTC and resistor materials realized in thick film technology. The excellent performance of a micro fluidic LTCC system will be shown based on a manufactured demonstrator. The final conclusion is, that these established manufacturing and integration methods offer a remarkable potential to meet the requirements for future circuit designs, where actual design concepts cannot solve all issues satisfying, in particular where harsh environmental conditions occur or a high integration concept is mandatory.
机译:低温共烧陶瓷(LTCC)建立为许多不同应用中的先进功能陶瓷电路的广泛平台,例如空间,航空,医疗和传感器技术。基于MLC(多层陶瓷)的系统允许集成导致高集成电平的无源元件。对于微流体装置,需要相同的3D结构与腔室的集成。使用LTCC由于高可靠性质量而预先集成传感器元件,陶瓷的良好特性以及优异的物理性质。为了实现3D微渠道,不仅在实验室状态,适用于制造过程是强制性的。本研究提出了微流体通道的实现,并在该方法中显示,在LTCC过程中可以通过一系列新的开发的制造方法实现这些方式。调查了3D激光结构和两个冷压花技术的基准,以表明各种技术的益处和界限。直接集成到LTCC体中的传感器元件基于PTC和电阻材料在厚膜技术中实现。微流体LTCC系统的优异性能将基于制造的演示器示出。最后的结论是,这些建立的制造和整合方法提供了符合未来电路设计要求的显着潜力,其中实际的设计概念无法解决满足的所有问题,特别是在苛刻的环境条件发生或高集成概念中是强制性的。

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