首页> 外文会议>Sensor Internaitonal Conference >Fine-pressure sensor in PCB-Technology: The move of the diaphragm into the printed circuit board
【24h】

Fine-pressure sensor in PCB-Technology: The move of the diaphragm into the printed circuit board

机译:PCB技术中的细压传感器:隔膜的移动进入印刷电路板

获取原文

摘要

At present there are many possibilities and technologies for the production of fine-pressure sensors each having their advantages and disadvantages. Large differences exist in overload protection, accuracy, long-term stability, drift, size and last but not least price. The following goals were pursued during the integration of the diaphragm in the circuit board: small size without compromising on reliability and overload protection, low cost manufacturing with high resolution, analogue and digital outputs.
机译:目前有许多可能性和技术用于生产细压传感器,每个都具有它们的优缺点。过载保护,准确性,长期稳定性,漂移,尺寸和最后但最不最少的价格存在大的差异。在电路板中的隔膜集成期间追求以下目标:小尺寸而不会影响可靠性和过载保护,低分辨率,模拟和数字输出的低成本制造。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号