Flexible inorganic electronics are electronics with the delicate integration of stiff electronic films on soft substrate. Unreasonable structure design usually accompanied with more problems of cracking of the film or interfacial failures. The stresses in the stiff thin film and soft substrate is thus important to a better design of the structure and to the reliability and performance of these electronics devices and systems. A Multi-scale method is adopted in this paper to obtain the precise stress distributions in the multi-layer structures. Analytical solutions are obtained for the multilayer structures (for both symmetric and non-symmetric cross-sections).
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