Process Technology for High-Resolution AM-PLED Displays on Flexible Metal Foil Substrates

摘要

The first successful integration of poly-Si thin-film-transistor (poly-Si TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless-steel foil is described, and a high-resolution (230 DPI) monochrome active-matrix polymer light-emitting diode (AM-PLED) display is demonstrated. The process technology required to implement this high-resolution AM-PLED display onto a flexible metal foil substrate is discussed. This technology primarily consists of the preparation of flexible metal foils, fabrication of the poly-Si TFT backplane, and integration with top-emitting PLEDs.