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首页> 外文期刊>Electrochemical and solid-state letters >Process Technology for High-Resolution AM-PLED Displays on Flexible Metal-Foil Substrates
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Process Technology for High-Resolution AM-PLED Displays on Flexible Metal-Foil Substrates

机译:柔性金属箔基板上高分辨率AM-PLED显示器的处理技术

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摘要

The first successful integration of a polysilicon thin-film transistor (TFT) backplane with polymer light-emitting diodes (PLEDs) onto a flexible stainless steel foil is described, and a high-resolution (230 dots/in.) monochrome active-matrix polymer light-emitting diode (AM-PLED) display is demonstrated. The process technology required to implement this high-resolution AM-PLED display onto a flexible metal-foil substrate is discussed. This technology primarily consists of the preparation of flexible metal foil, fabrication of the active matrix polysilicon TFT backplane, and integration with top-emitting PLEDs.
机译:描述了将多晶硅薄膜晶体管(TFT)背板与聚合物发光二极管(PLED)首次成功集成到柔性不锈钢箔上的方法,以及高分辨率(230点/英寸)的单色活性矩阵聚合物对发光二极管(AM-PLED)显示器进行说明。讨论了将这种高分辨率AM-PLED显示器实现到柔性金属箔基板上所需的工艺技术。这项技术主要包括柔性金属箔的制备,有源矩阵多晶硅TFT背板的制造以及与顶部发射PLED的集成。

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