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Is the Al Solubility Limit in SiC Temperature Dependent or not?

机译:是SiC温度依赖的Al溶解度限制吗?

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The so-called VLS (Vapour-Liquid-Solid) mechanism in an Al-Si melt has recently demonstrated the capability to grow at low temperature single crystalline 4H-SiC layers, with a high Al content. Using the newly developed VLS technique, we have deposited several 4H-SiC layers and determined the incorporated Al level by SIMS (Secondary Ion Mass Spectroscopy). Depending on the sample, we have found that the SIMS doping level ranges from 5X10~(19) to 1X10~(21) at.cm~(-3). This last value is the highest one reported so far for in-situ doped SiC:Al. From TEM (Transmission Electron Microscopy) analyses we show that the layers are single crystals, with a high density of defects located only at the lower interface and no foreign phase inclusion. These results compare well with the ones obtained in previous works using alternative doping techniques, like ion implantation, chemical vapour deposition or sublimation. It thus suggests that Al solubility limit in SiC is rather temperature independent.
机译:Al-Si熔体中所谓的VLS(汽液固体)机制最近证明了在低温单晶4h-SiC层中生长的能力,具有高Al含量。使用新开发的VLS技术,我们已经沉积了几个4H-SIC层,并通过SIMS(二次离子质谱)确定了合并的Al级别。根据样本,我们发现SIMS掺杂水平范围为5×10〜(19)到1x10〜(21).CM〜(-3)。最后一个值是迄今为止出于原位掺杂SIC:Al的最高价值。从TEM(透射电子显微镜)分析,我们表明层是单个晶体,仅位于下界面处的高密度缺陷,并且没有异物夹杂物。这些结果与先前的作品中获得的那些相比,使用替代掺杂技术,如离子注入,化学气相沉积或升华。因此,表明SiC中的Al溶解度限制是相当温度的。

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