The utilization of compound semiconductor materials has been steadily increasing, especially in the optoelectronics industry. Application of these materials typically requires the substrates to be greatly thinned below 100 urn prior to packaging. Due to the fragility of these substrate materials, some form of support is required for handling throughout the various process steps. The most established way in semiconductor industiy to create such support is the temporary mounting of those materials to rigid carrier substrates.This paper introduces a well-proven method of mounting and de-mounting these substrates in a fully automated manner. Through the use of various intermediate substances, including thermal and UV release dry-adhesive films, which can also be prepared and laminated fully automated, the substrates up to 200mm can be bonded to the carriers at wafer level in a cassette-to-cassette manner, optionally applying a protective coating to the substrate in the process. Once the substrates are mounted, further processing steps, such as thinning, via printing, etc., can be performed.Once the substrate has been thinned and backside processed, a second process is being used to de-bond the substrate from the carrier, mounting it to a dicing film or similar carrier solutions, again in a cassette-to cassette manner.
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