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Nanoscale Measurement of Stress and Strain by Quantitative High-Resolution Electron Microscopy

机译:通过定量高分辨率电子显微镜纳米级测量应力和应变

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The geometric phase technique (GPA) for measuring the distortion of crystalline lattices from high-resolution electron microscopy (HRTEM) images will be described. The method is based on the calculation of the "local" Fourier components of the HRTEM image by filtering in Fourier space. The method will be illustrated with a study of an edge dislocation in silicon where displacements have been measured to an accuracy of 3 pm at nanometre resolution as compared with anisotropic elastic theory calculations. The different components of the strain tensor will be mapped out in the vicinity of the dislocation core and compared with theory. The accuracy is of the order of 0.5 percent for strain and 0.1° for rigid-body rotations. Using bulk elastic constants for silicon, the stress field is determined to 0.5 GPa at nanometre spatial resolution. Accuracy and the spatial resolution of the technique will be discussed.
机译:将描述用于测量来自高分辨率电子显微镜(HRTEM)图像的测量结晶晶格变形的几何相位技术(GPA)。该方法基于通过在傅立叶空间中滤波来计算HRTEM图像的“本地”傅里叶组件。该方法将通过研究硅中的边缘位错研究,其中与各向异性弹性理论计算相比,在纳米分辨率下测量位移的精度为3μm。应变张量的不同部件将在位错核附近映射并与理论相比。对于应变的精度为0.5%,对于刚体旋转的0.1°。利用用于硅的体积弹性常数,应力场在纳米空间分辨率下测定为0.5GPa。将讨论准确性和该技术的空间分辨率。

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