首页> 外文会议>Mori Seiki International Conference on Die Mould Technology >Research on CLD of Ni-P Alloy Plating Used for Strengthening the Surface Technique of Smaller Aluminum-alloy Die
【24h】

Research on CLD of Ni-P Alloy Plating Used for Strengthening the Surface Technique of Smaller Aluminum-alloy Die

机译:用于强化较小铝合金模具表面技术的Ni-P合金电镀CLD研究

获取原文

摘要

The actions and affection factors of CLD of Ni-P alloy on increasing the Aluminum- alloy (LY12CZ) or fitting's surface hardness, improving its wearability and corrosion-resistance, as well as decreasing its manufacture-cost and enhancing its use-life are analyzed. The CLD of Ni-P alloy plating is a very effective method of delaying use-life, decreasing cost. The effect of technics process and the process parameters of the CLD of Ni-P alloy plating on the structure and properties of the Ni-P alloy plate are studied.
机译:分析了Ni-P合金CLD对铝合金(LY12CZ)或拟合表面硬度,提高其耐磨性和耐腐蚀性的动作和情感因素,以及降低其制造成本和增强其使用寿命。 Ni-P合金电镀的CLD是一种非常有效的延迟使用寿命方法,降低成本。研究了技术过程的效果和Ni-P合金电镀CLD的影响,研究了Ni-P合金板的结构和性质。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号