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Removal of Sulfuric Acid Mist Emissions from Semiconductor Manufacturing Process with an Efficient Scrubber System

机译:用高效的洗涤系统从半导体制造过程中除去硫酸雾排放

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According to Taiwan EPA's regulation for the semiconductor manufacturing industry, the removal efficiency of control devices for the H2SO4 mist should be more than 95%, or the total H2SO4 mist emission rate per factory should be less than 0.1 kg/hr. The collection efficiency of fine mist is not high enough when a conventional packed tower is operated. Our previous study showed that many semiconductor manufacturing facilities cannot maintain the removal efficiencies or the emission rates within the regulation criteria using wet scrubber system because of small H2SO4 mist diameter. This study was targeted to enhance the performance of packed towers for removal of low-concentrations of H2SO4 mist from waste gases. The use of low-concentration surfactant in scrubbing liquid for packed bed combined with a modified demister was demonstrated to enhance the pollutant removal efficiency. The proposed surfactant system was installed in one pilot scrubber and the pilot tests were performed under the operating conditions adopted from most of the wet-scrubbers operated in semiconductors manufacturing facilities. The performance of the improved scrubber system was evaluated and compared with the original one. The results showed that use of the surfactant with scrubbing liquid in packed bed enhances the H2SO4 removal efficiency averaged from 45.7 % (n=10) to 80.2 % (n=8). Similarly, use of the surfactant with scrubbing liquid in packed bed and in demister simultaneously enhances the overall removal efficiency averaged from 45.7 % (n=10) to 85.5 % (n=12) for inlet average concentration of 8.25 mg/m~3. This study showed that the application of surfactant with scrubber system could be used as a H2SO4 mist collector, especially for acidic waste gas in semiconductor manufacturing industry.
机译:根据台湾EPA对半导体制造业的监管,H2SO4雾的控制装置的去除效率应大于95%,或者每厂的总H2SO4雾排放率应小于0.1kg / hr。当操作传统的填充塔时,细雾的收集效率不够高。我们以前的研究表明,由于小的H2SO4雾直径,许多半导体制造设施不能使用湿式洗涤系统在调节标准内保持去除效率或排放速率。本研究旨在增强包装塔的性能,以从废气中去除低浓度的H2SO4雾。证明了使用低浓度表面活性剂在洗涤液中的液体与改性的演示者结合改性的演员,以提高污染物去除效率。所提出的表面活性剂系统安装在一个先导洗涤器中,并且在从半导体制造设施中运行的大多数湿式洗涤器采用的操作条件下进行试验试验。评估了改进的洗涤器系统的性能并与原始的。结果表明,用填充床中的洗涤液用表面活性剂的用来增强了从45.7%(n = 10)的H 2 SO 4去除效率为80.2%(n = 8)。类似地,使用填充床中的擦洗液和在除雾器中使用表面活性剂同时增强从45.7%(n = 10)到85.5%(n = 12)的总去除效率,用于入口平均浓度为8.25mg / m〜3。该研究表明,表面活性剂与洗涤器系统的应用可用作H2SO4雾收集器,特别是半导体制造业的酸性废气。

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