Mathematical Modeling To Simulate The Surface Topography of CMP Pad by Conditioning on Ebara 300 mm F-REX Polisher

摘要

Chemical Mechanical Planarization outcome depends on pad surface and pad physical characteristic.For either closed or opened pore structure pads,the pad surface has to he constantly rejuvenated by action of conditioning to maintain performance stability.Conditioning the pad is crucial step in CMP process.During the pad life,surface material of pad is constantly removed;hence,gradually shifts the pad thickness.Constant change in pad topography is dependent to conditioning parameters such as platen speed,conditioner (dresser) speed,ID/OD,and speed of oscillation.Mathematical model is used to study movement of diamond particle in the conditioner relative to the polishing pad.After integration,the pad thickness profile can be described as a function of the conditioner and conditioning parameters.The simulation results are verified by experimental results;therefore the mathematical simulation could be used to enhance the pad life and to optimize the pad performance.