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Cohesive Toughness Of Low-k Film With Periodically Changing Elastic Modulus: Cube-Corner Indentation

机译:具有周期性变化弹性模量的低k薄膜的粘性韧性:立方角压痕

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The through-thickness cohesive toughness is estimated by applying the cube-corner indentation method for an organosilicate glass (OSG), cured by monochromatic UV irradiation to obtain oscillating elastic moduli across the film thickness. Radial cracks induced by cube-corner indentation on as-deposited OSG film shows a straight crack path, while the indentation on OSG film with elastic modulus oscillation shows a disturbed crack path. The cohesive toughness increases from (0.059 ± 0.001) MPa.m~(1/2) to (0.063 ± 0.001) MPa.m~(1/2) after monochromatic UV curing.
机译:通过施加用于有机硅酸盐玻璃(OSG)的立方角缩进方法来估计贯穿厚度的粘性韧性,通过单色UV辐射固化,以在膜厚度上获得振荡弹性模量。由沉积的OSG膜上的立方角压痕引起的径向裂缝表示直裂缝,而具有弹性模量振荡的OSG膜的压痕显示出令人不安的裂纹路径。在单色UV固化后,粘性韧性从(0.059±0.001)mPa.m〜(1/2)到(0.063±0.001)MPa.m〜(1/2)增加。

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