printed circuits; assembling; stress effects; bending; bending strength; finite element analysis; failure analysis; residual stress effect; flexing strength; surface mount technology; reflow; baking; thermal expansion coefficient; CTE mismatch; packaging layers; solder joint interconnect strength; PCB assembly structure; PCB assembly test vehicle; solder balls; three-point bending test; finite element analysis; failure analysis; critical bending force;
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机译:残余应力对螺栓/螺母组件中螺栓疲劳强度的影响
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机译:残余应力对PCB组件弯曲强度的影响
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