integrated circuit interconnections; chip-on-board packaging; fine-pitch technology; soldering; eutectic structure; printing; flip-chip devices; fine pitch eutectic solder; flip chip interconnection; electronics packaging industry; interconnect demand; microscopic geometry; integrated circuit level; supporting board level; flip chip on board applications; competitive manufacturing costs; robust production capability; surface mount technology; under bump metallisation; stencil printing solder bumping; electrical resistance; electroless Ni plating; solder paste deposition; joint geometry reduction; stencil paste printing; bump formation; bump shear strength; squeegees; wafer fixtures; optimisation; bumping defect reduction; Ni;
机译:细间距共晶倒装芯片互连中的材料和工艺问题
机译:细间距挠性芯片倒装芯片中热塑性非导电薄膜材料的附着力和评估
机译:细间距倒装芯片组件在不同热漂移下Sn-Ag-Cu焊料合金金属间化合物生长的比较
机译:小间距共晶焊料倒装芯片互连中的材料和工艺问题
机译:用共晶铅锡和无铅焊料对塑料球栅阵列,芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
机译:锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
机译:小间距共晶焊料倒装芯片互连中的材料和工艺问题
机译:利用au-pt-pd厚膜导体在低温共烧陶瓷(LTCC)基板上分析细间距,倒装芯片焊料互连的拉伸强度行为