solders; eutectic structure; mechanical properties; electron backscattering; optical microscopy; scanning electron microscopy; surface morphology; hardness; elastic moduli; creep; tin compounds; intermetallics characterization; mechanical behaviour; solder alloys; Pb-free solders; materials properties; solder joints manufacturing; solder joints reliability; electronics packaging; reliable products processes; Sn-Pb-to-Pb-free soldering; Pb contamination; resulting microstructure; microstructure properties; unknown compositions; unknown structures; tolerable levels; relative content; intermetallic phases; thermodynamic calculations; multicomponent material behaviour; intermetallic precipitates formation; Sn-3.9Ag-0.6Cu alloys; 405 alloy; Sn-3.0Ag-0.5Cu alloys; 305 alloy; contamination levels; eutectic Sn-37Pb solder; eutectic SnPb solder; phase identification; optical microscopy; scanning electron microscopy; electron back scattered diffraction; phase morphology; phase orientation; nanoscales; nanoindentation; ultra-fine microstructures; complex microstructures; micromechanical properties; hardness property; elastic modulus; creep property; ambient temperature; elevated temperatures; SnAgCu; SnPb;
机译:SnAgCu与Sn-Pb焊料合金反应中的材料行为和金属间化合物特征
机译:SnAgCu和Sn–Pb焊料合金之间反应的材料行为和金属间化合物特征
机译:Sn-Zn基和Sn-Ag-Cu无铅焊料合金替代Sn-Pb焊料的界面反应的研究
机译:SnAGCU与SN-PB焊料合金反应中金属间化物质和机械性能的特征
机译:扩散驱动的微观结构演化及其对SnAGCU焊料合金力学行为的影响
机译:Ti-Zr二元合金种植牙的力学特性及生物力学和生物学行为
机译:活性金属有机助熔剂合金化的SnAgCu焊料的凝固和润湿行为
机译:snagCu与sn-pb焊料合金的微观结构演变和拉伸性能(预印)